SPH series was developed to improve productivity in sapphire polishing.
| Standart products (Typical calues) |
SPH-7 | SPH-9D | SPH-51 | SPH-53 |
| D50 (µm) | 0.25 | 0.30 | 0.10 | 0.07 |
| pH | 12.5 – 13.5 | 12.5 – 13.5 | 10 – 11 | 8 – 9 |
| Dilution | 1 : 2 | 1 : 2 | 1 : 2 | 1 : 2 |
| Abrasive | Alumina | Alumina | Colloidal Silica | Colloidal Silica |
SPH series was developed to improve your productivity in sapphire polishing. These unique CMP slurries, based on patented chemical formulations, are showing 3 to 4 times quicker removal rate for sapphire C plane compared with traditional colloidal silica slurry.
View polishing conditions and additional data in the Technical Datasheet below.
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