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CHEMICAL MECHANICAL POLISHING
CMP is a key technology in the manufacture of high-density electronic circuits used in making semiconductor with sub-0.35 micron feature size. The process uses advanced polishing techniques involving slurries - mixture of high-performance abrasives and chemicals. Baikowski works in close collaboration with DuPont Air Products Nanomaterials L.L.C. (DA NanoMaterials) to pool their CMP slurries expertise and better serve the Semiconductor industry needs. Headquartered in Tempe, Arizona, DA NanoMaterials combines the expertise of DuPont and Baikowski in developing abrasives for electronic applications with Air Products' manufacturing and technical leadership, on-site management capabilities, sales and marketing infrastructure and logistics expertise in providing the broad range of electronic gases and chemicals that surround a process tool. The company has manufacturing and formulation capability in Europe (Ruabon, UK), USA (Charlotte, NC and Dallas, TX), and Japan (Mie Prefecture). DA NanoMaterials operates state of the art application and formulation labs in USA (Tempe, AZ) and Japan (Kanagawa) For more information about CMP slurries, please contact DA NanoMaterials
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