Precision Polishing
Offering a wide range of grain sizes and abrasive surface areas, BAIKALOX, DURALOX and MALAKOFF powders and suspensions can be used to polish any kind of metal, mineral, ceramic or composite material with any polishing technique (DSP, CMP, jar...)
Baikowski R&D teams constantly improve processes for you to get the best balance between removal rate and surface finish.
CMP
- Semiconductors : chips, CMOS…
- Magnetic media : HDD, GMR heads, ...
BRA105
BAIKALOX B-Series BRA105 (jet milled)
CRYSTAL STRUCTURE : 90 % Gamma, 10 % Alpha
SPECIFIC SURFACE AREA : 95 m²/g
PARTICLE SIZE (D50) : 0.3 µm

