BaikoPolish - Solutions de polissage

Au fil des dernières décennies, nous avons développé notre expertise dans divers domaines de polissage (semi-conducteurs, optique de précision, métaux…). Nous offrons des solutions sur-mesure pour tout type de substrat.

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BA

BA15, BA20, BA100 & BA105 are unground powders.
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BA15-PSS

BA15-PSS is a basic waterborne slurry.
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BMA15

BMA15 is a ball-mill deagglomerated powder.
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BRA

BRA15 & BRA105 are jet-mill deagglomerated powders.
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CR

CR1, CR6, CR10, CR15, CR30F, CR125, CRA6 are jet-mill deagglomerated powders.
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CR-S

CR slurry series for polishing provides scratch-free finish.
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GE

GE1, GE6, GE15, GE30 & GEA6 are unground prowders.
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GE-S

GE slurry series for polishing are formulated from our High Purity Alumina powders.
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LS

LSDBM is a ball-mill deagglomerated powder.
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PA

PA alumina is particularly adapted to create polishing pastes.
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PB

PB products are available unground, jet milled (-CR), ball milled (-DBM) and with special deagglomeration (-MAR).
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SA

Baikowski® offers a wide range of SA products, available jet milled (-CR) & ball milled (-DBM).
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ALN-6L

We developed ALN-6L to deliver the best surface finish on AlN substrates without void defect.
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HK

HK Series of Diamond Slurry is optimized for lapping GaN and SiC wafer.
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PuBS – Pads

Baikowski® offers a wide range of polishing pads which are optimized for various applications such as sapphire,...
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SLT-50

SLT-50 slurry was developed for polishing Lithium Tantalate (LiTaO3) wafers, commonly used for SAW devices.
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SPH

SPH series was developed to improve productivity in sapphire polishing.
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YG-1

YG-1 slurry offers a highly precise control of roughness, flatness and critical angles during YAG polishing.
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