CMP - Polissage Mécano Chimique

Nous produisons des solutions dédiées à ce procédé de polissage de haute précision, aussi connu sous le nom de Planarisation Mécano Chimique.

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Accueil » Series » CMP - Polissage Mécano Chimique

HK

HK Series of Diamond Slurry is optimized for lapping GaN and SiC wafer.
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SLT-50

SLT-50 slurry was developed for polishing Lithium Tantalate (LiTaO3) wafers, commonly used for SAW devices.
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SPH

SPH series was developed to improve productivity in sapphire polishing.
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BRA105 – 4N 93% γ alumina milled powder

This deagglomerated powder can contain upon request 0,1% to 12% of...
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CR – 4N alumina milled powder range

CR1, CR6, CR10, CR15, CR30F, CR125, CRA6 milled powders offer...
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