CMP - Polissage Mécano Chimique

Brochures Alumine Haute Pureté

Téléchargez nos brochures Alumine Haute pureté qui vous aideront à trouver le produit...

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A125 – 4N γ alumina unground powder

When control of both, specific surface area and porosity are needed.

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BA – 4N alumina nanosized unground powder range

BA15, BA20, BA100 & BA105 products offer good control of the specific area and of the α or γ crystalline phase.

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BRA105 – 4N 93% γ alumina milled powder

This deagglomerated powder can contain upon request 0,1% to 12% of...

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CR – 4N alumina milled powder range

CR1, CR6, CR10, CR15, CR30F, CR125, CRA6 milled powders offer...

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BA – 4N alumina nanosized unground powder range

BA15, BA20, BA100 & BA105 products offer good control of the specific area and of the α or γ crystalline phase.

See this product

BRA105 – 4N 93% γ alumina milled powder

This deagglomerated powder can contain upon request 0,1% to 12% of...

See this product

CR – 4N alumina milled powder range

CR1, CR6, CR10, CR15, CR30F, CR125, CRA6 milled powders offer...

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HK

HK Series of Diamond Slurry is optimized for lapping GaN and SiC wafer.

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SLT-50

SLT-50 slurry was developed for polishing Lithium Tantalate (LiTaO3) wafers, commonly used for SAW devices.

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SPH

SPH series was developed to improve productivity in sapphire polishing.

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Nano-cerium oxide

Ultra-fine ceria particles (below 20 nm) dispersed in water

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