CMP - Chemical Mechanical Polishing

High Purity Alumina leaflets

Download our High Purity Alumina leaflets to help you find the product you need

See this product

A125 – 4N γ alumina unground powder

an unground powder when control of the specific surface area and...

See this product

BA – 4N alumina nanosized unground powder range

BA15, BA20, BA100 & BA105 unground offer control of the specific...

See this product

BRA105 – 4N 93% γ alumina milled powder

This deagglomerated powder can contain upon request 0,1% to 12% of...

See this product

CR – 4N alumina milled powder range

CR1, CR6, CR10, CR15, CR30F, CR125, CRA6 milled powders offer...

See this product

HK – Diamond slurries

HK Series of Diamond Slurry is optimized for lapping GaN and SiC wafer.

See this product

SLT-50 High performance wafer polishing slurries

SLT-50 slurry was developed for polishing Lithium Tantalate (LiTaO3) wafers, commonly used for SAW devices.

See this product

SPH – Sapphire polishing slurry range

SPH series was developed to improve productivity in sapphire polishing.

See this product

Nano-cerium oxide

Ultra-fine ceria particles (below 20 nm) dispersed in water

See this product