SPH series was developed to improve productivity in sapphire polishing.
|pH||12.5 – 13.5||12.5 – 13.5||10 – 11||8 – 9|
|Dilution||1 : 2||1 : 2||1 : 2||1 : 2|
|Abrasive||Alumina||Alumina||Colloidal Silica||Colloidal Silica|
SPH series was developed to improve your productivity in sapphire polishing. These unique CMP slurries, based on patented chemical formulations, are showing 3 to 4 times quicker removal rate for sapphire C plane compared with traditional colloidal silica slurry.
View polishing conditions and additional data in the Technical Datasheet below.
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