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SPH

SPH series was developed to improve productivity in sapphire polishing.

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Products characteristics

Standart products
(Typical calues)
SPH-7 SPH-9D SPH-51 SPH-53
D50 (µm) 0.25 0.30 0.10 0.07
pH 12.5 – 13.5 12.5 – 13.5 10 – 11 8 – 9
Dilution 1 : 2 1 : 2 1 : 2 1 : 2
Abrasive Alumina Alumina Colloidal Silica Colloidal Silica

SPH series was developed to improve your productivity in sapphire polishing. These unique CMP slurries, based on patented chemical formulations, are showing 3 to 4 times quicker removal rate for sapphire C plane compared with traditional colloidal silica slurry.

Removal rate

View polishing conditions and additional data in the Technical Datasheet below.

Resources

  • SPH Series Technical Data Sheet

Main applications

Sapphire polishing

Sapphire polishing

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