Find Your Polishing Match Faster with our dedicated Catalog
Baikowski® turns formulation know-how—particle crystallinity control, PSD engineering, and chemistries—into repeatable polishing results. With uniform, controlled removal rates, our solutions help you reach the target finish faster, improving performance, reliability, and the overall value of your final products.
What’s inside ?
- Abrasives: Alumina, Diamond, Silica, Ceria
- Formats: Slurries & Powders (ready-to-use and custom)
- By substrate family: Ceramics & Crystals, Metal, Film Forming Materials (CMP), Glass & Plastics
- Spec clarity: d50 (µm), pH (slurries), SSA & α/γ phase (powders), plus diamond mean size notation where applicable
Who is this catalog designed for? ?
- Optics & Photonics teams targeting clarity, haze control, and ultra-low roughness
- Power & RF device makers processing SiC/GaN and other hard crystals
- Semiconductor/CMP engineers seeking planarization, selectivity, and low defectivity
- Metallography labs prioritizing clean cutting, corrosion control, and easy post-polish cleaning
- Coatings & Polymers specialists aiming for gloss without orange peel
- And more
FAQ
Can you customize viscosity or pH?
Yes. We can tune particle size, base chemistry, viscosity, and pH to your process (tooling, plate/pad, target finish). Do not hesitate to contat us.
Do you provide TDS?
Yes—Technical Data Sheets are available on request for the shortlisted products.