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Crystal
HK – Diamond slurries
HK Series of Diamond Slurry is optimized for lapping GaN and SiC wafer.
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SLT-50 High performance wafer polishing slurries
SLT-50 slurry was developed for polishing Lithium Tantalate (LiTaO3) wafers, commonly used for SAW devices.
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SPH – Sapphire polishing slurry range
SPH series was developed to improve productivity in sapphire polishing.
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YG-1 Slurry for Yag polishing
YG-1 slurry offers a highly precise control of roughness, flatness and critical angles during YAG polishing.
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PuBS – Polishing Pads
Baikowski® offers a wide range of polishing pads which are optimized for various applications such as sapphire,...
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BMA15 – 4N α alumina nanosized milled powder
This
deagglomerated
powder is also suitable for dip coating & slip...
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BRA105 – 4N 93% γ alumina milled powder
This
deagglomerated
powder can contain upon request 0,1% to 12% of...
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CR – 4N alumina milled powder range
CR1, CR6, CR10, CR15, CR30F, CR125, CRA6
milled
powders offer...
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CR-S 4N alumina slurry series for polishing
CR
slurries
provides scratch-free finish.
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GE – 4N α alumina unground powder range
GE1, GE6, GE15, GE30 & GEA6 are
unground
powders provide control...
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GE-S – 4N alumina slurry series for polishing
GE
slurries
are formulated from our GE 4N powders and provide a...
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